The TOLL package offers exceptional on-board thermal cycling capability, enabling compact system designs by reducing PCB footprint. When used in SMPS applications, it also helps lower system-level manufacturing costs. With this expansion, the TOLL package is now suitable for a broader range of applications, allowing PCB designers to further reduce costs and better meet market demands.
The CoolSiC MOSFET 650 V G2 in TOLL packaging is now available with on-resistance options ranging from 10 mΩ to 60 mΩ, while the Q-DPAK package offers 7 mΩ, 10 mΩ, 15 mΩ, and 20 mΩ variants.