Infineon Introduces Industry's Highest Density 1 Gbyte DDR333 Registered Reduced Height Memory Modul

Munich, Germany – July 1, 2002 - Infineon Technologies (FSE/NYSE: IFX) today announced the availability of engineering samples of 1 Gigabyte (GB) Registered DDR333 SDRAM Dual Inline Memory Modules (DIMMs). Using 36 individual 256 Mbit memory chips in very compact FBGA (Fine-Pitch Ball Grid Array) packages, these new DIMMs are the highest density memory modules available for computer server and workstation memory applications. The FBGA package offers a superior compact solution than the currently widely used TSOP-II (Thin Small Outline Packages) or stacked TSOP-II alternatives, consuming about
60 percent less board space.

The growing popularity of rack-mount and “blade” servers for enterprise computing and communications applications is driving demand for reduced height (form factor 1U, height 1.2 inch) DIMMs. For these ultra dense high performance server applications high-density memories with reduced dimensions and low power consumption are the critical components. Infineon uses JEDEC (Joint Electronic Device Engineering Council) compliant FBGA packages to engineer the DIMM solution.

“This new high-speed, highest density DDR 333 DIMM was designed to specifically meet the request of leading computer companies, where speed, density and reliability are utmost concerns,” said Dr. Harald Eggers, Senior Vice President and General Manager, Memory Products Group at Infineon. “Initial customer feedback and system-level testing of the modules is very positive, and we are in the process of introducing this advanced design to JEDEC to establish it as a new market standard.”

The use of FBGA packaging is the only way to produce 1GByte DDR333 Registered DIMMs meeting the reduced height (1U) requirements for compact high-density memory systems. This type of package has been used with great success in graphics memory applications for several years. Infineon’s development of a server DIMM based on FBGA-packaged components is a further milestone to establish this technology as the high-speed memory package of choice as commodity devices reach even higher speeds and bandwidths.

Placement of memory components in a FBGA package requires about 60 percent less board space (96mm² versus 262mm²) compared to the TSOP package alternative. Additionally, electrical parasitics caused by the package itself are reduced by approximately 50 percent for the data pins: inductive loading (3.00nH vs 5.73nH), capacitive loading (0.32pF vs 0.79pF), and resistive loading (0.12 Ohm vs 0.23 Ohm. Not only are the absolute parasitic values lower, but tolerances can be maintained to a higher degree.

The superior electrical performance leads to improved signal integrity and simplifies the challenge of meeting the timing margins required for DDR333 speed. The lowered parasitic values also enable high-speed signals to travel with less electrical power. This reduces the power consumption and corresponding heat generated by the memory system.

Price and Availability

The new 184pin 1GB Registered DDR333 Reduced Height DIMM is organized in two banks for a total of 128MB x 72. They use 2.5Volts for power and 1.25Volts for signals. Sample quantities are currently available priced at US$1,300.00. Volume pricing is available on request.