- English
-
EnglishDeutschItaliaFrançais한국의русскийSvenskaNederlandespañolPortuguêspolskiSuomiGaeilgeSlovenskáSlovenijaČeštinaMelayuMagyarországHrvatskaDanskromânescIndonesiaΕλλάδαБългарски езикGalegolietuviųMaoriRepublika e ShqipërisëالعربيةአማርኛAzərbaycanEesti VabariikEuskeraБеларусьLëtzebuergeschAyitiAfrikaansBosnaíslenskaCambodiaမြန်မာМонголулсМакедонскиmalaɡasʲພາສາລາວKurdîსაქართველოIsiXhosaفارسیisiZuluPilipinoසිංහලTürk diliTiếng ViệtहिंदीТоҷикӣاردوภาษาไทยO'zbekKongeriketবাংলা ভাষারChicheŵaSamoa日本語SesothoCрпскиKiswahiliУкраїнаनेपालीעִבְרִיתپښتوКыргыз тилиҚазақшаCatalàCorsaLatviešuHausaગુજરાતીಕನ್ನಡkannaḍaमराठी
E-mail:Info@YIC-Electronics.com
Infineon and Delta Announce Technology Licensing and Transfer Agreement to Address the Power Managem
Joint press release from Delta Electronics Inc. and Infineon Technologies AG
June 27, 2002, Taipei Infineon Technologies (FSE/NYSE: IFX), one of the worlds leading providers of power semiconductors, and Delta Electronics, one of the largest power supply manufacturers in the world, today signed an agreement for the licensing and transfer of Infineons transfer mold packaging technology (also referred to as MegaDIP) to Cyntec, a subsidiary of Delta Electronics, Inc. Under the terms of the agreement, Infineon will also supply at least 50% of the power semiconductors needed by Cyntec to be incorporated into products manufactured using this technology.
The agreement is aimed at addressing the power electronics market for small power industrial drives and consumer drives (home appliances) as well as for power supply modules for PCs by combining the leading edge power semiconductors (IGBT, CoolMOS, SiC, OptiMOS and Power Control ICs) and packaging expertise of Infineon with the power electronics system and manufacturing expertise of Delta. The MegaDIP technology allows Cyntec to supply cost-effective Integrated Power Electronics Modules (IPEM) with superior thermal characteristics.
This agreement paves the way for the two companies to address the growing market for innovative integrated power modules for applications such as consumer drive control, power supply and voltage regulator modules. As power demand increases and environmental requirements become stricter, the demand on sophisticated power solutions becomes an increasing challenge, which will be met by the technological expertise of both companies.
With Infineons leadership position in power semiconductors like CoolMOS, IGBT and SiC devices, we are confident of extending our leading position as an innovative and reliable manufacturer of power electronic systems, said Bruce Cheng, Chairman and CEO, Delta Electronics, Inc.
Having Delta/Cyntec as a partner in the field of power electronics enables us to re-affirm our competence as an innovative technology leader, and puts us in an excellent position to fulfil the ever-growing power consumption demands of the industry efficiently and cost-effectively, said Dr. Reinhard Ploss, head of the business group Automotive & Industrial at Infineon Technologies AG.
June 27, 2002, Taipei Infineon Technologies (FSE/NYSE: IFX), one of the worlds leading providers of power semiconductors, and Delta Electronics, one of the largest power supply manufacturers in the world, today signed an agreement for the licensing and transfer of Infineons transfer mold packaging technology (also referred to as MegaDIP) to Cyntec, a subsidiary of Delta Electronics, Inc. Under the terms of the agreement, Infineon will also supply at least 50% of the power semiconductors needed by Cyntec to be incorporated into products manufactured using this technology.
The agreement is aimed at addressing the power electronics market for small power industrial drives and consumer drives (home appliances) as well as for power supply modules for PCs by combining the leading edge power semiconductors (IGBT, CoolMOS, SiC, OptiMOS and Power Control ICs) and packaging expertise of Infineon with the power electronics system and manufacturing expertise of Delta. The MegaDIP technology allows Cyntec to supply cost-effective Integrated Power Electronics Modules (IPEM) with superior thermal characteristics.
This agreement paves the way for the two companies to address the growing market for innovative integrated power modules for applications such as consumer drive control, power supply and voltage regulator modules. As power demand increases and environmental requirements become stricter, the demand on sophisticated power solutions becomes an increasing challenge, which will be met by the technological expertise of both companies.
With Infineons leadership position in power semiconductors like CoolMOS, IGBT and SiC devices, we are confident of extending our leading position as an innovative and reliable manufacturer of power electronic systems, said Bruce Cheng, Chairman and CEO, Delta Electronics, Inc.
Having Delta/Cyntec as a partner in the field of power electronics enables us to re-affirm our competence as an innovative technology leader, and puts us in an excellent position to fulfil the ever-growing power consumption demands of the industry efficiently and cost-effectively, said Dr. Reinhard Ploss, head of the business group Automotive & Industrial at Infineon Technologies AG.