Intel: Intel 3 “3nm” Process Technology Now in Volume Production

Intel has announced that its Intel 3 (3nm class) process technology is now in volume production at two wafer fabrication plants, with additional details about the new production node also provided. The new process delivers higher performance and greater transistor density and supports 1.2V voltage for ultra-high-performance applications. This node is aimed at Intel's own products as well as foundry customers, with plans for continued advancement in the coming years.

"Our Intel 3 is now in volume production at our facilities in Oregon and Ireland, including for the recently launched Xeon 6 'Sierra Forest' and 'Granite Rapids' processors," stated Walid Hafez, Vice President of Intel Foundry Technology Development.

Intel has consistently positioned the Intel 3 manufacturing process for data center applications, which require cutting-edge performance through improved transistors (compared to Intel 4), reduced transistor via resistance in the power delivery circuits, and design co-optimization. The production node supports <0.6V low voltage and >1.3V high voltage for maximum load. In terms of performance, Intel promises an 18% increase in performance at the same power and transistor density levels.

For the optimal combination of performance and density, chip designers must utilize a combination of 240nm high-performance and 210nm high-density libraries. Additionally, Intel customers can choose between three metal stack options: a 14-layer version to reduce costs, an 18-layer version for the best balance between performance and cost, and a 21-layer version for higher performance.

Currently, Intel is using its 3nm class process technology to manufacture Xeon 6 data center processors. Eventually, Intel's foundries will use this production node to manufacture data center-grade processors for customers.

Besides the standard Intel 3, the company will also offer Intel 3T, which supports through-silicon vias and can be used as a base chip. In the future, Intel plans to provide the enhanced-functionality Intel 3-E for chip and storage applications, as well as Intel 3-PT for performance enhancement in various workloads such as artificial intelligence (AI)/high-performance computing (HPC), and general PC performance.