STMicroelectronics Unveils Three-Year Global Manufacturing Restructuring and Modernization Plan

STMicroelectronics has recently released detailed information about its global manufacturing restructuring initiative. The plan aims to further enhance the company’s competitiveness, reinforce its position as a global semiconductor leader, and secure its long-term sustainability as an Integrated Device Manufacturer (IDM) by strategically leveraging its R&D, design, and production assets worldwide.

Specifically, ST is prioritizing investments in future-ready infrastructure, such as 300mm silicon wafer fabs and 200mm silicon carbide (SiC) fabs, with the goal of reaching substantial production scale. At the same time, the company will maximize the output and efficiency of its legacy 150mm and mature 200mm silicon wafer lines.

STMicroelectronics will continue to operate all of its current sites, while redefining the roles of some facilities to support long-term success. With a continued emphasis on sustainability, the company also plans to integrate artificial intelligence and automation technologies to further enhance efficiency in R&D, manufacturing, reliability, and certification processes. In addition, ST will invest in upgrading the technologies used across the organization.

During the 2025–2027 restructuring period, STMicroelectronics intends to strengthen its digital technology capabilities in France, expand analog and power technology in Italy, and boost mature process technologies in Singapore.

At its Agrate facility in Italy, the company plans to increase 300mm wafer production to 4,000 wafers per week, with the potential to scale up to 14,000 wafers weekly through modular expansion based on market demand. As focus shifts to 300mm wafers, the 200mm line at the Agrate site will transition to MEMS manufacturing.