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Samsung Display and LG Display Approved to Start Mass Production of OLED Panels for iPhone 16 Series

With Apple's iPhone sales projected to reach a three-year high, the expectations for Korean component manufacturers are also increasing. This includes not only Samsung Display and LG Display, which supply Organic Light Emitting Diode (OLED) panels, but also Samsung Electro-Mechanics and LG Innotek, which will continue to supply other components.

According to the electronic components industry news, Samsung Display and LG Display have been approved to begin mass production of OLED panels for the iPhone 16 series. Samsung Display is expected to produce 90 million units, while LG Display is projected to produce 43 million units.

Reports indicate that Samsung Display started mass production of OLED panels for the standard iPhone 16 and iPhone 16 Pro Max in June. LG Display is expected to begin with panels for the Pro models. Apple plans to gradually replace Liquid Crystal Display (LCD) panels with OLEDs.

Industry forecasts suggest that Samsung Electro-Mechanics and LG Innotek will see improved performance as Apple enters the artificial intelligence (AI) smartphone race. Apple is set to unveil its AI strategy at the Worldwide Developers Conference (WWDC) on June 10. Particularly this year, with the iPhone upgrade cycle approaching, sales of the AI-powered iPhone 16 series are expected to reach 235 million units, the highest since 2021.

It is reported that Samsung Electro-Mechanics and LG Innotek may begin mass production of iPhone 16 components in June. Samsung Electro-Mechanics has been supplying Multi-Layer Ceramic Capacitors (MLCCs), and LG Innotek is expected to supply camera modules for the high-end line of iPhone 16.

Both Samsung Electro-Mechanics and LG Innotek are also expected to continue supplying semiconductor substrates. In addition to MLCCs, Samsung Electro-Mechanics provides Apple with flip-chip ball grid array (FC-BGA) packaging, and according to reports, LG Innotek supplies the substrate for Antenna in Package (AiP).