Tongfu Microelectronics forms alliance with AMD and becomes AMD’s largest packaging and testing supplier

Tongfu Microelectronics, the fourth largest packaging and testing factory in the world and the second largest in mainland China, revealed in an interview with an investment institution that it has formed a "joint venture + cooperation" joint model with AMD, established a close strategic partnership, signed a long-term business agreement, and provided AMD AI PC chips and AI accelerator packaging and testing services for work training and reasoning are now AMD’s largest packaging and testing supplier, and AMD has also become a major customer of Tongfu Microelectronics.

This means that after gaining a place in the semiconductor industry in the mature wafer foundry process, mainland China's supply chain has also successfully conquered the popular advanced packaging field, seizing the advanced packaging market necessary for AI chips, and working with ASE Investment Holdings , KYEC and other Taiwanese manufacturers are competing for orders.

Faced with the competition for orders in the supply chain in mainland China, ASE Investment Holdings and KYEC are actively preparing for the war and actively strengthening their technical capabilities. Taking ASE Investment Control as an example, they will increase investment this year in response to customers adopting more advanced technologies and the industry entering a new era. growth cycle. KYEC has also expanded its production capacity and is optimistic that the second half of the year will be the real AI explosive year for the packaging and testing industry.

According to legal person analysis, AMD has a long-term cooperation with ASE Silicon Products, and KYEC has obtained some AI chip testing cooperation projects with AMD's FPGA chip designer Xilinx, although Tongfu Microelectronics is AMD's largest packaging and testing supplier. , Taiwanese manufacturers continue to maintain their position in the global packaging and testing industry with different competitive advantages.

In an interview with an investment institution, Tongfu Microelectronics revealed that the company and AMD have formed a joint venture + cooperation model, established a close strategic partnership, and signed a long-term business agreement. In addition to strengthening its cooperative relationship with AMD, Tongfu Microelectronics is also actively adjusting its product portfolio, improving its layout in high-performance computing, new energy, automotive electronics and other fields, and reducing the impact of the business cycle brought by the consumer electronics market.