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The report states that TSMC is expected to double its CoWoS production capacity next year due to its restructuring
On November 6th, the legal representative pointed out in a report that due to the CoWoS equipment still having a delivery time of 8 months, TSMC increased its monthly CoWoS production capacity to 15000 units through integrated fanout packaging (INFO) in November. It is estimated that TSMC's annual CoWoS production capacity will double next year.
Looking ahead to the production capacity of CoWoS next year, the legal representative predicts that TSMC's CoWoS annual production capacity will increase by 100% next year, with NVIDIA accounting for about 40% of TSMC's total CoWoS production capacity and AMD accounting for about 8%; As for the supply chain beyond TSMC, it can increase production capacity by 20%.
The legal representative believes that in order to diversify risks, Nvidia has increased its CoWoS production capacity layout for non TSMC supply chains such as Liandian, Riyuguang Investment Control, and Amkor, and will gradually increase production in the fourth quarter of this year.
It is reported that several months ago, the rapid demand for NVIDIA AI GPUs led to a serious shortage of advanced packaging capacity in TSMC's CoWoS. TSMC President Wei Zhejia once stated that he had previously had a conference call with customers to request the expansion of CoWoS capacity. Equipment manufacturers estimate that TSMC's total CoWoS production capacity will exceed 120000 units in 2023, and it will surpass 240000 units in 2024, with Nvidia achieving 144000 to 150000 units.
In order to deal with the problem of insufficient capacity, TSMC announced in July this year that it plans to spend nearly NT $90 billion to set up an advanced packaging wafer factory in Taiwan, China Zhuke Causeway Science Park. After two months of cross departmental negotiations, the Zhuke Management Bureau also officially issued a letter agreeing to TSMC's acquisition of approximately 7 hectares of land in the Zhuke Causeway Park. The new factory is expected to be completed by the end of 2026 and mass production will begin in the third quarter of 2027.
Looking ahead to the production capacity of CoWoS next year, the legal representative predicts that TSMC's CoWoS annual production capacity will increase by 100% next year, with NVIDIA accounting for about 40% of TSMC's total CoWoS production capacity and AMD accounting for about 8%; As for the supply chain beyond TSMC, it can increase production capacity by 20%.
The legal representative believes that in order to diversify risks, Nvidia has increased its CoWoS production capacity layout for non TSMC supply chains such as Liandian, Riyuguang Investment Control, and Amkor, and will gradually increase production in the fourth quarter of this year.
It is reported that several months ago, the rapid demand for NVIDIA AI GPUs led to a serious shortage of advanced packaging capacity in TSMC's CoWoS. TSMC President Wei Zhejia once stated that he had previously had a conference call with customers to request the expansion of CoWoS capacity. Equipment manufacturers estimate that TSMC's total CoWoS production capacity will exceed 120000 units in 2023, and it will surpass 240000 units in 2024, with Nvidia achieving 144000 to 150000 units.
In order to deal with the problem of insufficient capacity, TSMC announced in July this year that it plans to spend nearly NT $90 billion to set up an advanced packaging wafer factory in Taiwan, China Zhuke Causeway Science Park. After two months of cross departmental negotiations, the Zhuke Management Bureau also officially issued a letter agreeing to TSMC's acquisition of approximately 7 hectares of land in the Zhuke Causeway Park. The new factory is expected to be completed by the end of 2026 and mass production will begin in the third quarter of 2027.